CMOS image sensor (CIS) packaging specialist Tong Hsing Electronic Industries is poised to see revenue contribution ratio for automotive applications climb to over 45% in 2022, and is also stepping up its deployment in the low-earth-orbit (LEO) satellite field, according to the Yageo-affiliated company.

Apart from its own handset CIS wafer reconstruction business, Tong Hsing has successfully integrated the automotive CIS packaging resources of Kingpak Technology acquired earlier, and will continue capacity expansions for car-use CIS as it has landed backend orders from first-tier clients, said company president Heinz Ru.

Ru noted high-end automotive electronics will be the main growth driver for the company, due partly to the autonomous driving trend stoking demand for automotive CIS, and partly to increasing penetration of LED lights and high-power modules in EVs pushing up its ceramic substrate sales and modules packaging business.

Meanwhile, the raging development of LEO satellite applications is also driving RF packaging business growth for Tong Hsing, Ru continued.

Ru stressed that the company will continue enhancing its investment in Taiwan in 2022. Besides its new plant in Taoyuan, northern Taiwan to kick off commercial production soon, it will also expand capacities at its several other fabs, also in northern Taiwan, and will focus more on high-value applications such as metaverse, biomedical, and energy, apart from automotive and aerospace.

Through the sharing of internal resources and strategies of the pan-Yageo group, he continued, Tong Hsing will deepen relationships with global customers and suppliers while also enhancing deployments in more high-value domains.